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Shanxi Hainuo Technology Co.Ltd.

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Thermal Conductivity 0.085 Hollow Microspheres Reduce Mechanical Stress Improve Flameproof
Thermal Conductivity 0.085 Hollow Microspheres Reduce Mechanical Stress Improve Flameproof
  • Thermal Conductivity 0.085 Hollow Microspheres Reduce Mechanical Stress Improve Flameproof
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High-Density Hollow Microspheres with True Density 0.244-0.256 Dielectric Constant 1.2-2.2 (100MHZ) and Density 0.15-1.0 Product Description: Hollow ...
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